KAUST researchers integrate two-dimensional materials into silicon microchips
© 2023 KAUST; Mario Lanza
The laboratory of Associate Professor Mario Lanza has reported the first hybrid 2D-CMOS microchip. The article describes the integration of a hexagonal boron nitride sheet into CMOS microchips, the industry standard, to produce electronic circuits that demand less power, are smaller in size and have a longer lifespan. The study exploits the unique electrical and thermal properties of 2D layers into microchips, a highly sought achievement that promises to miniaturize microchips further. Lanza led a team of researchers from six different countries, and the KAUST Imaging and Characterization Core Lab contributed to the observations. Read the original research paper in Nature and about it at KAUST Discovery.